CEO Insight
APCON recently moved to a new, larger facility as a result of the company's push to incorporate new manufacturing requirements based on the increasing demand for the Intellapatch series.
The new building is significantly larger (42,000 sq ft), and with this expansion, APCON is making significant investments in advanced design and manufacturing capabilities. The engineering and manufacturing teams now have a larger space to meet the increasing demands for the Intellapatch Physical Layer Switch product line.
With the move comes a significant investment in manufacturing tools that will bolster our already solid manufacturing programs through improved process control and efficiency. The most significant additions will be board manufacturing capabilities that increase efficiency and improve quality. Our surface mount operation will incorporate a new, larger part matrix for component placement, additional Heller equipment to improve reflow capability, and a new Vectra Elite wave solder system from Electrovert.
What will this mean to our customers? By strengthening our circuit-board manufacturing processes, APCON's world-class production facility will deliver switches even more efficiently, and at the same time, with higher quality than ever. At APCON, our continued commitment is to guarantee your success by adding even more value into our Intellapatch solutions.
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